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Flip Chip Products

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Process technology that enhances mounting quality

Our Lineup;
Flip chip bonder related equipment using ultrasonic which applied crystal oscillator, LED, and SAW filters.
We support customer's rapid productions and processes from our low energy (Eco) equipment.

FC Bonder

FC Bonder

Outlines and Features of Products

This is an FC bonder using US bonding (ultrasonic waves).
The increased efficiency of ultrasonic waves allows bonding at low temperatures and in a short time, to avoid mechanical and thermal residual stress on the product, which in turn enables stable, high quality bonding.
A load/ultrasonic wave head can be chosen according to the application of the material or product. And, thus this bonder can be used for products such as TCXO and SAW filters as well as LEDs and CMOS.
A maximum of 12 wafers can be handled if optional equipment is used.

Bump Bonder

Bump Bonder

Outlines and Features of Products

This equipment is used to form gold stud bumps on various materials.
Our original capillary enables the forming of bumps especially suitable for FC bonding.
And, this equipment supports works within a square of 250mm, achieving a stable bump bonding of high quality.
A maximum of 12 wafers can be handled if optional equipment is used.

Precision Dispenser

Precision Dispenser

Outlines and Features of Products

This is a multipurpose dispenser that implements high-precision application and trace application (over line trace) on works.
High precision image processing (feedback function) achieves stable trace application.
And, detailed partition temperature control for the syringe enables highly accurate dispensing of adhesive.
This fully automated precision dispenser accurately accommodates trace application needs for LED fluorescent materials and underfill materials.
Moreover, if an application head is used, choices are possible. (air type, jet type, mechanical type)

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