本文へスキップします。

H1

Camera Module Products

コンテンツ

High quality means clean output

Productions of compact camera modules are increasing particularly in mobile phones. PFA, as a pioneer in the industry, has been the market leader with the wide variety of the manufacturing Equipment required for camera modules. We are also contributing to the product quality stability realizing high cleanness as well as high speed/precision.

Active Alignment Bonder(HM-A200)

Active Alignment Bonder(HM-A200)

Outlines and Features of ProductsNew Products

Fully automated equipment, that assembles image sensors and lens holder(VCM etc..) with adjusting optical axis. This equipment can finish the processes(Loading-UV resin applying-6 axis adjusting-UV irradiation-Unloading) automatically.
This equipment achieves high speed processing by the triple alignment stage and original focus scaning.
Also, this has twice throughput as conventional HM-A100 has.

Active Alignment Bonder for dual cameras(HM-A100D)

Active Alignment Bonder for dual cameras(HM-A100D)

Outlines and Features of ProductsNew Products

In smartphones, the adoption ratio of dual camera system is increasing, but PFA provide a fully automated device that adjusts the optical axis of the two cameras and fixes them to the bracket.
This equipment can finish the processes(Loading-UV resin applying-6 axis adjusting-UV irradiation-Unloading) automatically.

ACF/FPC Bonder

ACF/FPC Bonder

Outlines and Features of Products

This pastes ACFs and connects FPCs to camera module PCBs. Fully automated equipment that achieves low profile, low temperature and clean connections.

4 head multi-dispenser

4 head multi-dispenser

Outlines and Features of Products

Dispensor that applies dust trap resin and adhesive to camera module board with 4 heads in high speed.
This equipment is compatible with clean class 100.
Also, we manufacture special-order Dipensor that applies to the side and back of the module.

Holder Mounter (HM-50)

Holder Mounter (HM-50)

Outlines and Features of Products

This device applies adhesive to sensor PCBs and then mounts lens holders on them. Accurate mounting beyond that of conventional devices is now possible using image processing compensation and optical linear scale via a pixel-rich camera. We have achieved Class 100 or less by introducing measures for thorough cleanliness.

Filter Bonder

Filter Bonder

Outlines and Features of Products

Bonds and fixes optical filters to lens holders. Adhesive application, bonding filters and temporary UV curing are available under the condition of cleanliness class 100 or less with one equipment unit. Its versatility is remarkable and model change setting is done quite simply.

Focus Adjustment/Adhesive Application Device

Focus Adjustment/Adhesive Application Device

Outlines and Features of Products

This fully automated device adjusts lens focus for camera modules, applies UV adhesive and then performs UV curing as well as housing modules. Items such as focus chart, light source and adjustment software necessary for lens focus adjustment become customer furnished items.

Customized Equipment

We offer various sorts of customized devices, from camera module production devices for smartphones to camera modules for automotive cameras and wearable cameras, etc. Why not contact us to find out.

Examples of Custom Equipment
  • Wide varieties of adhesive applicators used in module processes
  • Shield case placer
  • Glass sealer for CCD/CMOS image sensors
  • Assembler for wafer-level camera module
  • Flip chip bonder
  • bump bonder
  • Optical axis adjustment devices for dual cameras
  • Optical axis adjustment devices for stereo cameras
  • Others

【全】スマホ切替

HOME

【全・En】copyright