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Technical Introduction

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Technical Capability

Foresight for emerginf the market, flexibility that can quickly correspond to a new change, and technical skill for creating the genuine machines. They are essential for satisfying the request from the customers, and making a value more than could be expected.We embody the an ideal equipment for customers by adding our core technology into our base skill, mechanical design and control design skill, and we propose the best solutions to customers.

Technical Capability

Surface mount

The technology mounting electronic components, such as a crystal oscillator and a LED tip, is a strong point. A construction method is the junction which uses a flip chip (US junction / heat eutectic bonding), ACF (anisotropic conductive film), ACP (conductive paste), and NCP (non-conductive paste). In addition, adhesives (heat curing / UV curing), alignment and assembly of an optical component is also treated. Mounting technology is work retention mechanisms, such as vacuum contact / hand / pressure sensitive adhesive sheet, etc., and holds control of the amount of pushing / load / parallelism at the time of mounting. The technology which meets the needs of customers, such as a high density package, high-temperature and low-temperature mounting, and flexible mounting, is pursued.

Inspection

The characteristic inspection (F value / CI value by an oscillating circuit) of a crystal oscillator, measurement (luminosity/wavelength) of high-intensity LED, the part inspection (work form / work defect) using image processing technology, the state inspection (impression) after mounting, etc. are strong points. The temperature control technology for inspection environment, and normal pressure / pressurization technology are held, and optical system technology, an algorithm, and image-processing software are also developed in the company. By image processing, flexible correspondences, such as recognition of a transparent electrode, part recognition over glass, and picture acquisition under work movement, are especially performed. Improvement in process efficiency is also proposed, supporting improvement in product quality.

Manufacturing

The manufacturing technology which uses laser is a strong point. Functions, such as trimming, dicing and welding (junction) of the work in the productive process of an electronic device, are included in equipment. Moreover, the exposure using laser or an electron beam is the technology cultivated with the optical disc production technology, and can build the machining machine combined with other technology.

Clean / Vacuum / Vibration suppression

Clean correspondence is considered over details, such as a casing encapsulated type actuator, an ionizer, dust air recovery, a style of wiring and piping, and paint exclusion with a glow. A vacuum is constituted complexly an evacuation optimization design, valve design technique, flexible region sealing technology, selection of material, etc. To vibration, material and an active damper excellent in vibration suppression are adopted, and the case design etc. which do not give vibration to a measurement system are performed.

Process

We consider “process technology” to be one of the important technology for utilizing the mechanical technology and control technology which are the core technology of equipment embodiment to the utmost. The optimal production condition that understood technology, such as material, the characteristic and also an environmental condition, is given to the parts and product assembled by equipment. Process technology realizes the stable operation and the high throughput of equipment. Furthermore, the merit of user-friendliness including flexibility is also offered. In order to realize the equipment needed early more, next, challenging new technology is still being continued.

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