本文へスキップします。

H1

History

コンテンツ

1980 Pioneer Corporation production technology center is founded.
Development of the production facility for in-house use is started.
1984 Sales of Insertion equipment of different form parts is started.
1985 Sales of Light-Beam Soldering System is started.
Sales of Automatic adjustment inspection equipment is started.
1991 Development and Sales of Automatic adjustment inspection equipment for TCXO is started.
1995 Pioneer FA Corporation is established.
Development and Sales of Blank Mounter for crystal devices is started.
Equipment enterprise is started completely.
1997 Development and sales of Pick-up assemble Equipment for CD/DVD・Inspection Adjustment Equipment is started.
Development and Sales of Inspection equipment for Accelerometer is started.
1998 Development and Sales of FOG Bonder/COG Bonder for LCD&OLED panel is started.
The research about Ultrasonic Flip Chip Joint Process is started.
2000 Sales of FC Bonder/Bump Bonder is started.
2002 Development and Sales of Equipment for Camera module is started.
2003 Development and Sales of Temperature test equipment of the Peltier system is started.
2004 Sales of CAM software for chip mounter is started.
2005 Taipei office operation.
2007 OEM providing of Mounting CAM Software for Chip Mounter is started.
2008 New office building completion.
Complemention of the new company building that has Clean room.
Development of the LED Chip Prober and Sorter is started.
Sales of Manufacturing Inspection Equipment for MEMS sensor is started.
2009 Development and Sales of Inspection Adjustment Equipment for GYRO sensor is started.
Sales of LED chip sorter/chip prober is started.
Development and Sales of ACF Joint Equipment for Solar Battery is started.
2010 Development and Sales of FOG Bonding for touch panel is started.
2011 Development and Sales of High speed Blank Mounter is started.
2013 Development and Sales of Active alignment Bonder is started.
Development and Sales of FPD Bonding AOI is started.
2015 Development and Sales of Active alignment Bonder for Dual Cameras is started.
2018 Transferred to SHINKAWA LTD.
Changed the company name to PFACorporation

【全】スマホ切替

HOME

【全・En】copyright