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We will exhibit at NEPCON JAPAN 2019

【お知らせ:詳細】What's New

2018.12.17Other

We will exhibit at "NEPCON JAPAN 2019 - 20th IC & SENSOR PACKAGING TECHNOLOGY EXPO" to be held at Tokyo Big Sight from 16th (Wed) to 18th (Fri) January 2019.
During this period, we will be exhibiting the following new products and we would really appreciate if you could visit to our great booth.
We are looking forward to seeing you.

Products :  New product: Wire Bonder, UTC - 5000NeoCu Super
       New product: Small chip Die Bonder, STC-800 (Epoxy Version)
Booth No.: E24-47

For details, please click here.