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We will exhibit at SEMICON Japan 2018

【お知らせ:詳細】What's New

2018.11.26Other

We will exhibit at "SEMICON Japan 2018" to be held at Tokyo Big Sight from 12th (Wed) to 14th (Fri) December 2018.
During this period, we will be exhibiting the following new products and we would really appreciate if you could visit to our great booth.
We are looking forward to seeing you.

Theme: Smart Factory
Products: New product: Wire Bonder, UTC - 5000NeoCu Super
               New product: Small chip Die Bonder, STC-800 (Epoxy Version)

For details, please click here.