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Invitation to NEPCON JAPAN 2018

【お知らせ:詳細】What's New

2017.12.20Other

NEPCON JAPAN 2018 - 19th IC & SENSOR PACKAGING TECHNOLOGY EXPO will be held at Tokyo Big Sight, Tokyo, JAPAN from January 17th through 19th 2018.
Shinkawa will exhibit and demonstrate the main machines. 

<Demonstrate Machine> 
Wire Bonder       UTC-5000NeoCu
Package Bonder  FPB-1s NeoForce
Bump Bonder     SBB-5200

<Shinkawa Booth> 

E24-48, Hall East
Please click here for more information.