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H1

What's New

【タブ】What's New

  • 2016.05.13Product

    Shinkawa to Release Package Bonder for Multiple Processes FPB-1s NeoForce

  • 2015.08.26Product

    Shinkawa to Release a High-speed, High-accuracy Flip Chip Bonder YSB55w

  • 2015.06.30Product

    Update to the Discontinued Equipment

  • 2015.05.15Product

    Shinkawa to Release High-Accuracy Twin-Head Die Bonder SPA-1000

  • 2014.03.11Product

    Shinkawa to release Discrete Application Eutectic Die Bonder STC-800

  • 2013.10.28Product

    Shinkawa to release New Model for Transistors and LEDs

  • 2013.10.28Product

    Shinkawa to release Flip Chip Bonder LFB-1102Super for TCB process

  • 2013.06.26Product

    Shinkawa to release Wire Bonder UTC-5000NeoCu for Cu wire

  • 2013.05.27Product

    Shinkawa to release Flip Chip Bonder LFB-2301 for TCB process

  • 2013.03.28Product

    Update to the Discontinued Equipment page

  • 2012.11.09Product

    Shinkawa to release Flip Chip Bonder LFB-1102 for TCB process

  • 2012.12.04Technology

    Shinkawa to release UTC-5000 Wire Bonder

  • 2012.05.08Technology

    Update of the Technology information page