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Our Core Technologies

3D-NRS Technology: (three-dimensional non reaction servo system)

3D-NRS Technology: (three-dimensional non reaction servo system)

In order to ensure bonding accuracy and increase productivity, it is necessary to reduce mutual interference due to vibration of the drive units. In the SPA-1000, the 3D-NRS technology controls vibration of the two high-speed bonding heads, enabling high productivity as well as high precision. The model has bonding accuracy of XY±5 µm (3σ) and θ±0.05° (3σ), achieving twice the UPH of a conventional model.

Applicable Model(s)

Bond Inspection Measurement (BIM)

Bond Inspection Measurement (BIM)

BIM is the capability to correct bonding position by feedback of the positional deviation of each bonding position from the pad center using images captured after bonding. It corrects in real time any positional deviation due to disturbances during the bonding operation, and stabilizes the bonding accuracy.

BIM (Bond inspection measurement)

Applicable Model(s)

Free Air Ball Measurement (FAM): Automatic free air ball size monitoring capability

Free Air Ball Measurement (FAM): Automatic free air ball size monitoring capability

FAM is a unique technology of Shinkawa which monitors free air ball (FAB) diameter during wire bonding, and detects its abnormality at the same time, to stabilize the diameter. To detect abnormality, the function to monitor capillary tip position – called reference positioning system (RPS: will be introduced soon) – is utilized. FAM is a key technology to support the highly reliable bonding of the UTC-5000 series.

FAM (Free Air Ball Measurement)

Applicable Model(s)