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Our Challenges

Connect with chain bonds: Capillary Wedge Bonding (CWB)

Connect with chain bonds: Capillary Wedge Bonding (CWB)

Connect with chain bonds: Capillary Wedge Bonding (CWB)

NAND flash memories, widely used as a storage medium such as the familiar USB memory stick, and for large-scale cloud servers, are produced by stacking many dies for increased capacity. Signals from the stacked dies are transmitted through bonded fine metal wires. Conventionally, to bond wires on stacked dies, it is necessary to bond the wire, terminate it, and then bond additional wires on the subsequent steps. This is a time-consuming task and has been one of the productivity bottlenecks in NAND flash memory production.

Shinkawa has developed a high speed chain wire bonding method using CWB and CWB with bump (CWBB) technologies which allows multi-stack wire bonding in a single, continuous cycle without terminating wires. Shinkawa continues to refine this technology so that a wide range of customers can benefit from its short cycle time.

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Handling ultra thin die for bonding: PV-RMS

Handling ultra thin die for bonding: PV-RMS

Handling ultra thin die for bonding: PV-RMS

The thickness of multilayered NAND flash memories has been reduced to less than 30 um including an adhesive layer. Although silicon is a relatively hard material, it will bend readily and break easily at this thickness. In making a device, a die pickup technique is necessary, but it is extremely difficult to remove an ultra thin die attached to the wafer tape.

You may have experienced that peeling off a bandage quickly caused pain. Alleviating this pain is compared to the function of Pulse Vacuum-Reverse Multi Step (PV-RMS) that picks up thin dies from wafer tape. By pulsing vacuum from the outside of wafer tape, the PV-RMS promotes peeling of the die while reducing the adhesive force – corresponding to the reduced pain that would result from a similar method of bandage removal. It is effective not only for thin dies but also for dies with a fragile TSV structure. This is a key technique for future electronic device packaging.

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Connect efficiently: Flip-chip Collective-bonding

Connect efficiently: Flip-chip Collective-bonding

Connect efficiently: Flip-chip Collective-bonding

As dies become larger, thinner and more densely populated with interconnects, reduced die warpage and increased die placement precision are required during flip chip bonding. To address this issue, the thermal-compression bonding (TCB) process has been proposed. It has been used in the latest memories manufactured by the through-silicon-via (TSV) process such as high bandwidth memory (HBM) and hybrid memory cube (HMC).

Thermocompression bonding enables simultaneous solder bonding of interconnects and curing of underfill. However, the thermocompression bonding process requires a cycle time of about 10 seconds, which limits the improvement of productivity.

Shinkawa conducts basic research and develops sub-system technologies applicable to various methods for collective bonding of multiple dies such as gang-bonding.

We reported at the Electronic Components and Technology Conference (ECTC) 2017 that productivity can be improved up to 20 times by a combination of optimized sub-system technologies and usage of the high-speed TCB bonder FPB series.

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Align them to connect! Small die high-density bonding

Align them to connect! Small die high-density bonding

Align them to connect!  Small die high-density bonding

In the IoT society where sensors are installed in nearly everything, it is essential to include various functions in as compact a space as possible. Shinkawa has the technology to handle small dies with a size of around 100 um, and offers a bonding machine with high-speed (maximum UPH over 20,000) and optional high accuracy (XY accuracy ±15 um @ 3σ) capabilities. This machine is able to place 150 um dies at regular intervals of 30 um as shown in the photograph. It can handle die sizes between 100 um and 3 mm, enabling compact design of devices mixed with MEMS and RF modules, and will play an important role in the IoT era.

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From connecting to making: the wire bonder as electronic device manufacturing equipment

From connecting to making: the wire bonder as electronic device manufacturing equipment

From connecting to making: the wire bonder as electronic device manufacturing equipment

Conventionally, a wire bonder has been widely used as a machine for connecting electrical signals. The connecting demand will never go away, and in fact, it has propelled us to create a wire bonder that can place and shape wires freely. Its capability allows the wire bonder to evolve into an electronic component manufacturing machine by creating coils – important parts of electronic components.

For example, it is possible to create coils with specific impedance or create supplementary coils for circuit adjustment. Shinkawa is continually working on new challenges based on wire bonding technology.

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Cleaning before connecting is important: Dust Free Cleaner (DFC)

Cleaning before connecting is important: Dust Free Cleaner (DFC)

Die Attach Film (DAF), an adhesive used for NAND flash memories, is as thin as 5 um. The NAND flash memories are often stacked in multiple stages. When a new die is stacked, if fine particles of 5 um or more are present on an object to be bonded, die cracking may occur and the productivity may decrease. Cleaning before die stacking is, therefore, an essential factor for successful multi-stack bonding.

Shinkawa was among the first to address this issue and developed a dust free cleaner (DFC) unit, which has a cleaning speed 60 times faster than the conventional model. Its high-speed cleaning capability is recognized by the industry’s leading manufacturers as a contributor to total productivity improvement.

In addition to DFC, Shinkawa will strive to develop technologies related to cleanliness control and provide tools to increase customers' productivity.

Cleaning before connecting is important: Dust Free Cleaner (DFC)

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