I am in charge of development of bonding processes in wire bonding, particularly in the area of various new bonding techniques and methods, (which entail the joining of electrodes of IC chips and the lead frame using metal wire).
In wire bonding, heat, load, and ultrasonic waves are used to join the wires and semiconductor device circuits. My main task is to verify the required degree of application of these three energies to achieve the bonding required by customers. In the demonstration process, deciding on what tests to perform and how to analyze the data obtained is important. Bonding is influenced by various characteristics including the material of the wire and the material and structure of the device, among other things and, therefore, a broad knowledge of semiconductor manufacturing processes is required.
For a new bonding method, we first prepare the necessary functions and actions together with the device designer. We then actually confirm the bonding before proceeding with development. In most cases, problems are detected, so we improve the function and confirm the bonding again. We generally repeat this flow of procedures a number of times.