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H1

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Joined: 2014, new graduate
Major at university: Superconductivity Physics


As an undergraduate, Y. H. studied physical properties resulting from the interaction of electrons and crystals. Also interested in machines and programming, he was attracted to Shinkawa’s proprietary technology for controlling equipment at high-speed and with high-precision, and during the recruitment and selection process, he nominated software as his preferred area. During the interview process, Y. H. was introduced to work at Shinkawa in metal bonding technology, which is essential in bonding systems. At that time, he felt that this might be an area that would satisfy his interest in physics, and he decided to join the company. At present, he is working on the development of bonding processes and using programming for data analysis.

To achieve the bonding required by our customers,
deciding on what tests to conduct and how to analyze the data we obtain is important.

I am in charge of development of bonding processes in wire bonding, particularly in the area of various new bonding techniques and methods, (which entail the joining of electrodes of IC chips and the lead frame using metal wire).

In wire bonding, heat, load, and ultrasonic waves are used to join the wires and semiconductor device circuits. My main task is to verify the required degree of application of these three energies to achieve the bonding required by customers. In the demonstration process, deciding on what tests to perform and how to analyze the data obtained is important. Bonding is influenced by various characteristics including the material of the wire and the material and structure of the device, among other things and, therefore, a broad knowledge of semiconductor manufacturing processes is required.

For a new bonding method, we first prepare the necessary functions and actions together with the device designer. We then actually confirm the bonding before proceeding with development. In most cases, problems are detected, so we improve the function and confirm the bonding again. We generally repeat this flow of procedures a number of times.

Our workplace has an atmosphere that allows us
to freely engage in the research and experiments of our choice.

Process development fundamentally involves making it possible to bond objects that at present cannot be bonded. The opportunities for coming into contact with new, special semiconductor products are set to increase, and will enable me to gain knowledge in broad areas besides bonding. I find this aspect of my work very exciting.

I often pay visits to customers to obtain information about their products. I also go overseas on business frequently. This is an excellent work environment for anyone who wants to play an active role in the global arena. Many negotiations with customers take place both within the company and at sales offices in Japan and other countries. Therefore, a certain level of proficiency in English is necessary. (The company also has program for supporting the study of English.)

To achieve superior bonding, various data are required. Since I am interested in statistical processes and data analysis methods, I try to conduct various kinds of analyses of data gathered from experiments as much as possible. I have learned these analytical methods through study in the course of my work. At Shinkawa, the workplace environment has an atmosphere that allows staff to freely engage in study that interests them and in experiments of their choice.

Using techniques that result in differences depending
on the experience of the individual, I would like to arrive
at a theoretical understanding that will facilitate use of systems.

At this stage of development, we cannot say that we have an adequate understanding of bonding technology from a theoretical perspective. In many cases, when we attempt to determine bonding conditions, we do an approximate calculation based on experience and instinct, and then adopt a method of trial and error.

This approach is not only time consuming but also results in different outcomes depending on the experience of the operator. I would like to make it possible to execute this work as automatically as possible, and to facilitate the use of systems. Therefore, I want to learn methods of data analysis and machine learning, and to be actively involved in the verification and operation to enable me to deepen my understanding of bonding on theoretical grounds.

At the moment, the majority of demonstrations are carried out within the company. In the future, however, used through operations at customers’ plants, I would like to get a firm grasp of the kind of the environment and circumstances in which systems are being and apply our findings to development.