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Application Procedures for Mid-career Applicants

  • Step1Document selection
    Send your curriculum vitae (with photo attached) and employment history via email or postal mail.
  • Step2Written exam
    You will take a written exam that covers different areas based on the job you are applying for (technology, English, short essay, etc.)
  • Step3Interviews
    You will have one or two interviews where you will be asked to discuss your experience to date, your career aspirations and other matters.
  • Decision

Guidelines for Mid-career Applicants

Business description
Research, development, design, manufacturing, sales, and maintenance services of semiconductor manufacturing equipment

See business details

Job title
Machine Design Engineer
Work Details
Development of future technologies for drivers for semiconductor manufacturing equipment, and design and development of new models for semiconductor manufacturing equipment
Applicant Qualifications (For example)
  • Experience in the development of high-acceleration, high-precision positioning systems including actuators.
  • Broad knowledge of mechanical engineering, and knowledge of machinery, structure, vibration, and thermal analysis.
  • Experience in the combined design and development of motors and mechanisms.
  • Basic knowledge of science of at least a fourth-year university science and engineering student.
  • Machine design engineer with ability to derive solutions.
  • Practical experience using 3D-CAD (inventor, even better).
  • English proficiency at a level of TOEIC 400 or higher.
  • etc.
Electrical Design Engineer
Work Details
Design and development of new equipment models for semiconductor manufacturing equipment, electrical design of customer specifications for semiconductor manufacturing equipment, research and development of control circuits for next-generation semiconductor manufacturing equipment
Applicant Qualifications (For example)
  • Practical experience in fitting electrical equipment for manufacturing equipment.
  • Knowledge of power electronics.
  • Ability to create specifications for circuit design for CPU control circuits including microcomputers and DSP.
  • Ability to design signal processing circuits for FPGA using VHDL, etc.
  • Ability to design motor control circuits using pulse motors and AC servomotors, etc.
  • Basic knowledge of electrical and electronics engineering.
  • Basic knowledge of science of at least a fourth-year university science and engineering student.
  • Practical experience using CAD (AutoCAD, OrCAD).
  • English proficiency at a level of TOEIC 400 or higher.
  • etc.
Control Software Design Engineer
Work Details
Design and programming of control software for semiconductor manufacturing equipment
Applicant Qualifications (For example)
  • Practical experience in control system programming.
  • Experience in development in C (C++ even better).
  • Extensive design experience in interruption processing.
  • Interest not only in software but also in hardware.
  • Basic knowledge of science of at least a fourth-year university science and engineering student.
  • English proficiency at a level of TOEIC 400 or higher.
  • etc.
Image Processing Software Development Engineer
Work Details
Research and development of machine vision software for next-generation semiconductor manufacturing equipment
Applicant Qualifications (For example)
  • Experience in the development of machine vision software (C, C++, assembler, etc.).
  • Experience as a development project leader.
  • At least three years’ practical experience in the development of image processing software.
  • Basic knowledge of science of at least a fourth-year university science and engineering student.
  • etc.
Optical Engineer
Work Details
Research and development of machine vision optics for next-generation semiconductor manufacturing equipment
Applicant Qualifications (For example)
  • Experience in the development of optics.
  • Experience in development using optical CAD and 3D-CAD, and experience in optical, structure, thermal, and fluid analyses using CAE.
  • Deep knowledge of optics, and basic knowledge of machine engineering.
  • etc.
Bonding Process Development Engineer
Work Details
Development of bonding processes for semiconductor manufacturing equipment (development of micro bonding technologies for bonding processes)
Applicant Qualifications (For example)
  • Knowledge of semiconductor packaging materials.
  • Knowledge of semiconductor bonding technologies, metal materials, liquid analyses, and plasma technologies.
  • Language skills (English proficiency at a level of TOEIC 600 or higher) or business experience in dealing with overseas clients (using English).
  • Engineer with ability to derive solutions.
  • Practical experience in machine design and drafting.
  • etc.
Bonding (Application) Engineer
Work Details
Development of bonding technologies for semiconductor manufacturing equipment based on customer demand (including technical proposals and support for customers to demonstrate to the maximum the performance of the company’s equipment. This include assessment of equipment, basic experiments, analysis of operation, and to determining the cause when a problem occurs, etc.)
* This position requires a maximum of about four weeks overseas business travel a year.
Applicant Qualifications (For example)
  • Experience as an application engineer or field engineer.
  • Knowledge of trigonometric function calculations, structures, physics, and chemistry.
  • Willingness to learn English.
  • Ability to do long-term continuous domestic and overseas business travel of about one month.
  • etc.

See employee interviews

Applicant documents
Curriculum vitae (with photo attached) and employment history
Method of selection
Written examination, selection of documents, interviews (1 to 2 times)
Allowances
Commuting allowance, overtime work allowance (there is no unpaid overtime whatsoever)
Days off and leave
2 days off per week (Saturday and Sunday), public holidays, End of Year/New Year holidays, congratulatory and condolence leave
* Days off per year: 122
Social welfare
Full social insurance (employment, health, work-related injury, employee pension), dormitory for single employees, company housing, company cafeteria, retirement benefits (defined benefit corporate pension), asset-formation savings plan, employee stock-holding society (with incentives), life insurance group discounts, affiliated recreation facilities, welfare loan plan, home loan plan, routine health examinations, full parking facilities

Details of the work environment

Work location
Musashimurayama City, Tokyo
Working hours
8:45 – 17:25 (55-minute break, actual working time: 7 hrs. 45 min.)

Applicant Information

Please forward your resume and work history (with a photo attached) to the following postal mail or email address:

Attn: Employment Officer

Personnel & Administration Department,
Shinkawa Ltd.
2-51-1 Inadaira, Musashimurayama-shi, Tokyo 205-8585, Japan

Tel(Direct): +81 (0)120 520 118

E-mail:skw.recruiting@shinkawa.com

Recruitment Officers: Dr. Tobisawa & Mr. Yamashita