本文へスキップします。

H1

コンテンツ

Company Overview

Company Name SHINKAWA LTD.
Head Office 2-51-1 Inadaira, Musashimurayama-shi, Tokyo 208-8585, Japan
Telephone Number +81-42-560-1231
Established August 6, 1959
Paid-up Capital 8,360 million yen
Fiscal Year From April 1 to March 31
Stock Market Tokyo Stock Exchange, First Section
Number of Employees 681 (as of March 31, 2016)
Business Research, development, designing, manufacturing, sales and after-sales service of semiconductor manufacturing equipment.
Product Lineup Wire bonders, die bonders and flip chip bonders, etc.
Group Companies
  • Shinkawa Technologies Ltd. (Tokyo)
  • Shinkawa Korea Co., Ltd. (Seoul)
  • Shinkawa Taiwan Co., Ltd. (New Taipei City)
  • Shinkawa (Shanghai) Co., Ltd. (China)
  • Shinkawa Philippines, Inc.(Metro Manila)
  • Shinkawa Vietnam Co., Ltd.(Ho Chi Minh City)
  • Shinkawa Singapore Pte. Ltd.(Singapore)
  • Shinkawa (Malaysia) Sdn. Bhd.(Subang Jaya)
  • Shinkawa (Thailand) Co., Ltd.(Pathumthani)
  • Shinkawa Manufacturing Asia Co., Ltd.(Pathumthani)
  • Shinkawa U.S.A., Inc.(Arizona)

SHINKAWA LTD.

Factory in Thailand

History of SHINKAWA

SHINKAWA LTD. was founded in 1959 – the year that the world witnessed the birth of the first integrated circuit (IC) in the U.S. – and has kept pace with the evolution of semiconductors ever since. SHINKAWA started out with secondary transistor processing, expanded the scope of its business during the 10 years that followed the Company’s founding to conduct the development, manufacture and marketing of such custom-made products such as jigs and fixtures for semiconductor assembly and semiconductor testers and handlers. After the oil shocks of the early 1970s, the Company concentrated its management resources on the development of automated equipment used in the assembly process of semiconductor manufacturing.
All of these endeavors underpin what we are today – a specialized manufacturer of semiconductor assembly equipment.

  • August 1959
    Shinkawa Seisakusho Co., Ltd. was founded to engage in secondary processing of transistor parts (Paid-up capital ¥1 million, Head office located in Mitaka-shi, Tokyo)
  • February 1960
    Commenced production of jigs and fixtures for semiconductor assembly
  • January 1964
    Built a new plant in Musashimurayama-shi, Tokyo
  • January 1967
    Moved head office to Musashimurayama-shi, Tokyo Introduced semi-automatic bonder for transistors
  • April 1970
    Introduced automatic wire bonder for ICs
  • August 1972
    Introduced integrated type microcomputer for the first time in the industry
  • September 1976
    Began exporting of wire bonders to the U.S.
  • June 1977
    Introduced the world’s first, fully automatic wire bonder and tape bonder
  • January 1978
    Introduced type fully automatic wire bonder with digital bond head system
  • January 1980
    Introduced type fully automatic die bonder with digital bond head system
  • February 1980
    Changed the company name to SHINKAWA LTD.
  • April 1984
    Introduced inner lead tape bonder
  • December 1985
    Introduced in-line system
  • September 1988
    Listed on the Second Section of the Tokyo Stock Exchange Established Shinkawa Singapore Pte. Ltd. In Singapore
  • September 1989
    Established Shinkawa U.S.A., Inc. in the U.S.
  • June 1994
    Introduced wire bonder with inspection capability
  • November 1994
    Established Shinkawa (Malaysia) Sdn. Bhd. in Malaysia
  • August 1996
    Established Shinkawa Taiwan Co., Ltd. in Taiwan
  • December 1996
    Established Shinkawa Korea Co., Ltd. in Korea
  • April 1999
    Acquired ISO9001 certification
  • January 2000
    Established Shinkawa (Thailand) Co., Led. in Thailand
  • April 2000
    Established SKT Ltd. (currently Shinkawa Technologies Ltd.)
  • September 2000
    Upgraded to the First Section of the Tokyo Stock Exchange
  • April 2001
    Established Kyushu Service Center in Fukuoka
  • May 2001
    Introduced 300mm wafer handling die bonder
  • November 2001
    Established Shinkawa (Shanghai) Co., Ltd. in the People’s Republic of China
  • December 2001
    Introduced wire bonder with NRS/RPS capability
  • February 2006
    Established Shinkawa Philippines, Inc. in the Republic of the Philippines
  • July 2008
    Introduced wire bonder with BIM capability
  • August 2009
    Established Shinkawa Vietnam Co., Ltd. in Vietnam
  • March 2010
    Introduced flip chip bonder for TCB process
  • February 2012
    Established Shinkawa Manufacturing Asia Co., Ltd. in Thailand
  • May 2016
    Introduced package bonder for multiple processes