本文へスキップします。

H1

コンテンツ

The world is changing, but we are building lasting
relationships of mutual trust with our customers.

I would like to welcome our future members to our website! For over half a century, we at Shinkawa Ltd. have made important contributions to the world through our unique bonding technology for manufacturing semiconductor equipment and our loyalty to our customers.

The world is dramatically changing as we move toward a new era that is being referred to as the “4th Industrial Revolution,” which is being driven by new technologies of artificial intelligence (AI) and the internet of everything (IoT). At present we are witnessing the emergence of significant technological innovations and new business models which are transforming our daily lives.

We very much look forward to working together with all of you, who have boundless curiosity and will create new value in technology in the new era. Despite the dramatic changes in our world, building and maintaining relationships of mutual trust with our customers, business partners and colleagues are always our top priority at Shinkawa.

Go, Go, Go!

As the pioneer that successfully invented the first model for automatic wire bonder machines, we ushered in a new era with the introduction of our “Shinkawa Smart Bonding Solutions,” a new approach using IoT. Motivated by my motto “Go, Go, Go!,” which means pushing ahead with our work as always, I have renewed my determination to create a better world through technology in collaboration with all our customers, business partners and colleagues. I sincerely look forward to working with you as members of the “Team Shinkawa”!

Takashi Nagano
President and CEO, Representative Director