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Shinkawa’s bonding systems represent the crystallization of cutting-edge technologies

Wire bonders, which are key products of Shinkawa, are precision robots required in the manufacture of semiconductors. In the post-processing (assembly process) of semiconductor manufacturing, IC chip and lead frame electrodes are connected by metal wire.

Dialogue with people through a Windows-based graphic user interface (GUI). With a built-in CCD camera and sensor, it detects the operating position and monitors the use of equipment with high accuracy, and it controls high-speed operation with a linear motor drive.

Interacting with humans, observing, thinking and then taking action. Shinkawa’s bonding systems incorporate a wide array of cutting-edge technologies including not only mechatronics but also the discharge, ultrasonic, fluid control, robotics, material engineering, and image processing technologies.

Shinkawa’s technologies continue to lead the world

Bonding equipment that incorporates state-of-the-art technologies is essential for achieving higher functionality, miniaturization, and thinner semiconductors. Shinkawa’s bonding equipment connects about 20 metal ultrathin wires that are about one-fifth of a strand of hair per second. Only Shinkawa can achieve this speed and accuracy, thanks to its superior world-leading technologies.

In addition to our main lineup of wire bonders, we also manufacture die bonders and flip chip bonders, as we continue to meet the needs of the semiconductor world. In recent years, we have incorporated AI into bonding equipment, and continue to study for autonomy of the equipment.

Shinkawa's state-of-the-art technology

Shinkawa's bonding equipment is packed with impressive cutting-edge technologies. Our technologies aim to improve everyday living, and connect the world and the future. Using discharge, ultrasonic, fluid control, robotics, material engineering and image processing technologies, Shinkawa is achieving cutting-edge bonding technologies and high-speed, high-accuracy mounting.