Wire bonders, which are key products of Shinkawa, are precision robots required in the manufacture of semiconductors. In the post-processing (assembly process) of semiconductor manufacturing, IC chip and lead frame electrodes are connected by metal wire.
Dialogue with people through a Windows-based graphic user interface (GUI). With a built-in CCD camera and sensor, it detects the operating position and monitors the use of equipment with high accuracy, and it controls high-speed operation with a linear motor drive.
Interacting with humans, observing, thinking and then taking action. Shinkawa’s bonding systems incorporate a wide array of cutting-edge technologies including not only mechatronics but also the discharge, ultrasonic, fluid control, robotics, material engineering, and image processing technologies.