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H1

Wire Bonders

UTC-5000NeoCu High Speed Cu Wire Bonder Capable of Handling Wide Range of Product-Types from Fine Pitch Devices to Power Devices

UTC-5000NeoCu
High Speed Cu Wire Bonder Capable of Handling Wide Range of Product-Types from Fine Pitch Devices to Power Devices

UTC-5000NeoCu High Speed Cu Wire Bonder Capable of Handling Wide Range of Product-Types from Fine Pitch Devices to Power Devices

  • Capable of handling bare Cu wire and Pd coated Cu wire, achieving high speed bonding of 45ms/2mm
  • Capable of high quality bonding with QFN devices and heavy Cu wire by installing a bonding head with a maximum bond force of 1000gf and high rigidity transducer
  • Shorter product-type changeover time achieved by digitalizing the flow rate of inert gas
  • Equipped with electric flame-off unit capable of handling wire sizes φ15-50μm without changing unit
  • Enhanced portability with self-diagnostic function that optimizes servo parameters
  • Capable of indexing 95mm x 300mm lead frames by allowing Y bonding area of 87mm
  • Minimum detectable capacitance of 1pF achieved by AC nonsticking detector, allowing more advanced high precision nonsticking detection
  • Facilitating the optimization of bonding parameters by automatic free air ball size setting
  • Prevention of misplaced bonding by automatic bonding monitor function (BIM: Ball Inspection Measurement) that measures ball size and position, and feeds back information on positional deviation
  • Correction of variations in ultrasonic output among machines by US current auto-correction function (UCAC)(※)
  • Automatic free air ball monitor function (FAM) measuring free air ball size
  • Capable of stable 35 μm pad pitch bonding with low vibration, high-speed drive using Shinkawa NRS technology
  • Position correction function using temperature detection added to capillary tip position automatic correction through Shinkawa’s RPS technology(※)
  • Maintenance work facilitated by automatic clamper calibration(※)
  • Capable of handling various types of devices with a variety of loop modes using Shinkawa ICP multi-loop mode technology and loop locus stabilization (XYZ control)(※)
  • Capable of handling large-size magazines by use of magazine stacker system

Specification

ITEM DETAILS
Product Name Wire Bonder
Model UTC-5000NeoCu
Bonding Accuracy ±2.0 μm(3σ)Using Shinkawa standard device
Correction of Bonding Position System to check and correct capillary offset prior to bonding through Shinkawa RPS
(In combination with offset amount correction with temperature detection)(※)
Bonding Speed 45 ms/2 mm wire with loop control and force detection mode Using Shinkawa standard device
Bonding Wire Length 8 mm maximum (Varies depending on device conditions)
Resolution XY-table: 0.1 μm  Z-axis: 0.1 μm
Vibration Control Shinkawa NRS - Non Reaction Servo System
Bonding Area X:±28 mm, Y:±43.5 mm
Wire Size Au / Cu φ15–50 μm
Bonding Force 3–1,000gf
No. of Bonding Wires 30,000 wires maximum
Loader/Unloader Fully automatic magazine stacker system (Option: stocker system))
Workpiece Size Width 20– 95 mm (20–93 mm when carrier type)
Length 95–300 mm
Thickness 0.07–2.0 mm (Varies depending on type of device)
(Conversion parts are required when thickness changes)
Production Management Management of equipment availability through production management monitoring screen
Options Available Communication interface  SECS-I/SECS-II, HSMS, GEM
Utilities Input Power Supply Single Phase 100 VAC (±5% input variation) 50/60Hz (other voltage requires transformer)
Power Consumption Approx. 1.3kVA
CDA 500kPa (5 kgf/cm2) 100L/min
Vacuum -74kPa or below (-550 mmHg) (gauge)
Physical Dimensions and Mass 1,222W × 964D × 2,087H mm  Approx.520 kg

※1 indicates the specifications of the upgraded version. Please contact our sales representative for details.
※2 Configuration and specifications of this machine are subject to partial modification without prior notice.

UTC-5000 High Speed Wire Bonder Capable of Handling Wide Range of Product-Types from Fine Pitch Devices to Power Devices

UTC-5000
High Speed Wire Bonder Capable of Handling Wide Range of Product-Types from Fine Pitch Devices to Power Devices

UTC-5000 High Speed Wire Bonder Capable of Handling Wide Range of Product-Types from Fine Pitch Devices to Power Devicess

  • Platform that achieved high speed bonding of 45ms/2mm with completely updated X, Y and Z motors
  • Capable of high quality bonding with QFN devices and heavy Cu wire by installing a bonding head with a maximum bond force of 1000gf and high rigidity transducer
  • Equipped with electric flame-off unit capable of handling wire sizes φ15-50μm without changing unit
  • Capable of indexing 95mm x 300mm lead frames by allowing Y bonding area of 87mm
  • Minimum detectable capacitance of 1pF achieved by AC nonsticking detector, allowing more advanced high precision nonsticking detection
  • Facilitating the optimization of bonding parameters by automatic free air ball size setting
  • Prevention of misplaced bonding by automatic bonding monitor function (BIM: Ball Inspection Measurement) that measures ball size and position, and feeds back information on positional deviation
  • Correction of variations in ultrasonic output among machines by US current auto-correction function (UCAC) (※)
  • Automatic free air ball monitor function (FAM) measuring free air ball size
  • Capable of stable 35 μm pad pitch bonding with low vibration, high-speed drive using Shinkawa NRS technology
  • Position correction function using temperature detection added to capillary tip position automatic correction through Shinkawa’s RPS technology(※)
  • Maintenance work facilitated by automatic clamper calibration (※)
  • Capable of handling various types of devices with a variety of loop modes using Shinkawa ICP multi-loop mode technology and loop locus stabilization (XYZ control) (※)
  • Capable of handling large-size magazines by use of magazine stacker system
  • Capable of Cu wire and Ag wire bonding (option)

Specification

ITEM DETAILS
Product Name Wire Bonder
Model UTC-5000
Bonding Accuracy ±2.0 μm(3σ)Using Shinkawa standard device
Correction of Bonding Position System to check and correct capillary offset prior to bonding through Shinkawa RPS
(In combination with offset amount correction with temperature detection)(※)
Bonding Speed 45 ms/2 mm wire with loop control and force detection mode Using Shinkawa standard device
Bonding Wire Length 8 mm maximum (Varies depending on device conditions)
Resolution XY-table: 0.1 μm  Z-axis: 0.1 μm
Vibration Control Shinkawa NRS - Non Reaction Servo System
Bonding Area X:±28 mm, Y:±43.5 mm
Wire Size Au φ15–50 μm (Bump bonding φ15–30 μm)
Bonding Force 3–1,000gf
No. of Bonding Wires 30,000 wires maximum
Loader/Unloader Fully automatic magazine stacker system (Option: stocker system))
Workpiece Size Width 20– 95 mm (20–93 mm when carrier type)
Length 95–300 mm
Thickness 0.07–2.0 mm (Varies depending on type of device)
(Conversion parts are required when thickness changes)
Production Management Management of equipment availability through production management monitoring screen
Options Available Communication interface  SECS-I/SECS-II, HSMS, GEM
Utilities Input Power Supply Single Phase 100 VAC (±5% input variation) 50/60Hz (other voltage requires transformer)
Power Consumption Approx. 1.3kVA
CDA 500kPa (5kgf/cm2) 100L/min
Vacuum -74kPa or below (-550 mmHg) (gauge)
Physical Dimensions and Mass 1,222W × 964D × 2,087H mm  Approx.520 kg

※1 indicates the specifications of the upgraded version. Please contact our sales representative for details.
※2 Configuration and specifications of this machine are subject to partial modification without prior notice.

UTC-5100 High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability

UTC-5100
High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability

UTC-5100 High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability

  • Platform that achieved high speed bonding of 42ms/0.7mm (45ms/2mm) with completely updated X, Y and Z motors
  • Capable of high quality bonding on diversified devices by installing a bonding head with a maximum bond force of 1000gf and high rigidity transducer
  • Equipped with electric flame-off unit capable of handling wire sizes φ18-50μm without changing unit
  • Capable of indexing 102mm x 300mm lead frames by allowing Y bonding area of 95mm
  • Minimum detectable capacitance of 1pF achieved by AC nonsticking detector, allowing more advanced high precision nonsticking detection
  • Facilitating the optimization of bonding parameters by automatic free air ball size setting
  • Simultaneous detection and bonding capability in X and Y directions
  • Capable of setting lighting color (red/blue) effective in improving detection rate
  • Capable of handling various types of devices with a variety of loop modes using Shinkawa ICP multi-loop mode technology
  • Capable of handling large-size magazines by use of magazine stacker system
  • Facilitating the maintenance work by reviewing Z calibration method
  • Capable of Cu wire and Ag wire bonding (option)
  • Capable of handling multiple indexing processes (open feeder/tunnel feeder, etc.)

Specification

ITEM DETAILS
Product Name Wire Bonder
Model UTC-5100
Bonding Accuracy ±3.0 μm (3 σ), (The bonding accuracy changes depending on the conditions of device and temperature)
Bonding Speed 42 ms/0.7 mm wire (45 ms/2 mm wire)
(with loop control and force detection mode) Using Shinkawa standard device
Bonding Wire Length 4 mm maximum (Varies depending on device conditions)
Resolution XY table: 0.1 μm, Z-axis: 0.1 μm
Vibration Control Shinkawa NRS - Non Reaction Servo System
Bonding Area X: 66mm - Camera offset, Y: 95mm - Camera offset
Wire Size φ18–50 μm
Bonding Force 3–1,000 gf
No. of Bonding Wires 12,000 wires maximum
Loader / Unloader Fully automatic magazine stacker system (Option: stocker system)
Workpiece Size Width 20–102 mm
Length 95–300 mm
Thickness 0.1 - 0.5 mm (Varies depending on type of device)
(Conversion parts are required when thickness changes)
Production Management Management of equipment availability through production management monitoring screen
Option Available Communication interface SECS-I/SECS-II, HSMS, GEM
Utilities Input Power Supply Single Phase 100VAC (±5% input variation) 50/60Hz  (other voltages require transformer)
Power Consumption Approx.1.2kVA (1.1kW)
CDA 500kPa (5 kgf/cm2) 102L/min
Vacuum -74kPa (-550 mmHg) or below (gauge)
Physical Dimensions and Mass 1,222W × 964D × 2,087H mm  Approx. 520kg

※ Specifications are subject to change without prior notice