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H1

Die Bonders

SPA-1000 High-Accuracy Twin-Head Die Bonder

SPA-1000
High-Accuracy Twin-Head Die Bonder

SPA-1000 High-Accuracy Twin-Head Die Bonder

  • High-accuracy bonding by unique 3D-NRS technology
  • High-productivity and space-saving footprint by adopting twin-head
  • High-speed thin die pick-up system with a speed of 400ms / t:20um(option) *Depending on material conditions
  • Friction-free bonding head with simultaneous positional and force control for thin die stacked devices
  • Cleanness control with HEPA-filter and stainless steel full cover
  • Equipped with die back-side camera on each bonding head, enhancing inspection function with a total of 8 cameras
  • Capable of handling large substrates up to 120mm width x 300mm length

Specification

ITEM DETAILS
Product Name Die Bonder
Model SPA-1000
Bonding Method DAF bonding
Accuracy XY:±5μm (3σ)、θ:±0.05°(3σ) (Machine accuracy excluding material-induced factors)
Productivity The productivity increased by 2.5 times compared with conventional model.
(Theoretical value with Shinkawa's standard sample)
Chip Size □0.8 – 25mm
Wafer Size Maximum 12-inch
Substrate/Leadframe Size Width 40 – 120mm
Length 180 – 300mm
Thickness 0.05 – 0.8mm
Options Available Thin die application kit, Film attachment unit, capability to handle overhead transport (OHT)
Utilities Input Power Supply Single Phase AC200V±5% 50/60Hz (Other power supply options available on request)
Power Consumption Maximum 3.2 kVA (3.2kW)
Air 500kPa (5kgf/cm2) 900 L/min 
Vacuum Below -74kPa (-550mmHg) (gage)
Physical Dimensions and Mass Approx. 2,280W × 1,510D × 1,670H mm Approx. 2,300 kg
(excludes monitor display and signal tower)

※ Configuration and specifications of this machine are subject to partial modification without prior notice.

STC-800 Discrete Application Die Bonder

STC-800
Discrete Application Die Bonder

STC-800 Discrete Application Die Bonder

  • Bonding accuracy ±20μm (3σ)
  • 10% increase in UPH compared with the conventional model
  • High-precision lead frame indexing utilizing linear drive
  • Capable of handling 86mm width frame, enabling to bond up to 76mm width Y bonding area
  • Equipped with a self-diagnostic system, providing long-term stable operation
  • Capable of handling several device conditions by the parameter settings of wafer tape expansion amount and the zoom function for the die recognition camera

Specification

ITEM DETAILS
Product Name Die Bonder
Model STC-800
Bonding Method Thermo-eutectic
Bonding Accuracy XY:±20μm (3σ), θ:±3°(3σ) based on bonding conditions at Shinkawa
Machine Cycle Time 0.140s / chip (at Y=40mm)
Average based on bonding conditions at Shinkawa
0.168s / chip  UPH 21,400
Lead Frame Indexer Setting Temperature Room temperature - 500℃ (3ch control)
Wafer Tape Expansion Amount 5 - 15mm (variable)
Chip Size □0.12 - 1.5mm 
Wafer Size Maximum 8-inch
Workpiece Size Width 20 – 86mm (maximum bonding area=76mm)
Length 120 – 260mm (maximum bonding area=10mm)
Thickness 0.1 - 0.4mm
Options Available Magazine loader stocker type
Utilities Input Power Supply Single phase AC 200V±5% 50 / 60Hz (Other power supply options available on request)
  Power Consumption 1.4kVA(1.3kW) Maximum
  Air 400kPa (4kgf / cm2) 250L / min Connection :φ8 Tube 2 spots
  N2 Gas 200 kPa (2 kgf / cm2) 10L / min Connection:φ6 Tube 1 spot
  Forming Gas N2 95%+H2 5%
  Vacuum Below -87kPa (-650mmHg) (gage) Connection:φ8 Tube 1 spot
Physical Dimensions and Mass Approx. 880W×1,050D×1,500H mm Approx. 1,160kg (excludes monitor display and signal tower)

※ Configuration and specifications of this machine are subject to partial modification without prior notice.