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H1

Bump Bonders

SBB-5200 Wide Area Handling High-speed Wafer Bump Bonder

SBB-5200
Wide Area Handling High-speed Wafer Bump Bonder

SBB-5200 Wide Area Handling High-speed Wafer Bump Bonder

  • High-speed bonding of 30 ms/bump based on Wire Bonder model UTC-5000
  • Capable of handling up to 6-inch wafers by incorporating wafer rotary stage
    ※8-inch wafer handling capability (1 wafer stage) scheduled to be developed.
  • Equipped with Two wafer stages with temperature up/down control function, reducing wafer changeover time and increasing productivity
  • Capable of stable 45 μm pad pitch bonding with low vibration, high-speed drive using Shinkawa NRS technology
  • Automatic correction of capillary tip position by Shinkawa RPS technology, enabling high accuracy bond placement and reducing work for capillary change
  • Automatic free air ball monitor function (FAM) measuring free air ball size
  • Multiple choices for surface contact detection at bonding, with "Force detection mode" to detect changes in force in real time as well as conventional "Positional detection mode," enabling stable bonding quality

Specification

ITEM DETAILS
Product Name Bump Bonder
Model SBB-5200
Bonding Accuracy ±2.5 μm(3σ)Using Shinkawa standard device
Correction of Bonding Position System to check and correct capillary offset prior to bonding through Shinkawa RPS
Bonding Speed 30 ms/ bump (without reverse)  Using Shinkawa standard device
Bonding Wire Length 8 mm maximum (Varies depending on device conditions)
Resolution XY-table: 0.1 μm  Z-axis: 0.1 μm
Vibration Control Shinkawa NRS - Non Reaction Servo System
Bonding Area Maximum φ150 mm (6-inch wafer)
Wire Size Au φ15–32 μm
Bonding Force Maximum 4.9 N
No. of Bonding Bumps 30,000 bumps maximum
Wafer Stage 2 wafer stages for 6-inch wafers ※with temperature up/down control function
Wafer Size Size Maximum 6 inches
(Conversion parts are required when wafer size changes.)
Thickness 0.15–0.6 mm
(Conversion parts may be required when wafer thickness changes.)
Production Management Management of equipment availability through production management monitoring screen
Options Available Automatic wafer loader for 6-inch wafer (Under development)
Utilities Input Power Supply Single Phase 100 VAC (±5% input variation) 
50/60Hz (other voltage requires transformer)
Power Consumption Approx. 1.1kVA
CDA 500kPa (5 kgf/cm2) 100L/min
Vacuum -74kPa or below (-550 mmHg) (gauge)
Physical Dimensions and Mass 1,000W × 1,088D × 2,087H mm  Approx.500 kg

※ Configuration and specifications of this machine are subject to partial modification without prior notice