SHINKAWA Group will achieve the medium-term management plan "Challenge Shinkawa2020" and return to the top of the industry!
The global economy maintains a recovery trend supported by the United States and Europe with their robust domestic demand. Meanwhile, uncertainty still continues due to increased concern about the policies of Western countries as well as the economic slowdown of emerging countries.
In the electronics industry, along with the spread of IoT, the investment toward high-speed wireless communications continues. In addition, capital investment for in-vehicle devices grows favorably.
To address the trend of the semiconductor packaging business toward increasingly miniaturized, high-precision and low-cost devices, the Group has engaged in several initiatives. These include promoting the sales of cost-competitive and high-value-added products, acquiring new customers including major OSAT providers, and transferring production to the Thai factory to reform the earnings structure. These measures have proceeded steadily and, in the fiscal year ended March 31, 2017, the Group broke out of deficit for the first time in eight consecutive years.
In recent years, not only personal computers and smartphones but also various things such as household electric appliances, automobiles and factory equipment have begun connecting to the internet, ushering in the IoT (Internet of Things) society. As the IoT field is expected to be a new driving force in the semiconductor market as well as a trigger to create a new era of the semiconductor industry, the Group has established a medium-term management plan "Challenge Shinkawa 2020", which ends in fiscal 2020. The Group aims to be the leading bonding technology company and to grow continuously by making a tireless effort for innovation in bonding technology.
President and CEO, Representative Director