1．Growth in existing business
With the arrival of the IoT age, there are various changes in demand for semiconductor packages. The Group promotes the
functional enhancement of wire bonders and die bonders to handle the use of SSD data storages and high-speed memories.
The Group also promotes the development and sales expansion of flip chip bonders to handle advanced bonding processes
such as thermal compression bonding for 3 and 2.5-dimensional bonding applications that are used for memory cubes and the
latest CPUs. Furthermore, along with higher functionality of communication devices such as smartphones, the Group
enhances the function of flip chip bonders for high-performance packages such as PoP (Package-on-package) and FO-WLP
(Fan-out Wafer Level Package).
2．Creating new business value
The Group, under the concept of “Shinkawa Smart Bonding Solution,” continues the development of solution technologies
that incorporate the IoT function into the semiconductor assembly process. The Group will increase customer satisfaction and
its associated value by promoting intelligent machines (with enhanced sensing function), intelligent networks (with enhanced
data collection and analysis functions), and intelligent processes (with know-how embedded in software), as well as proposing
solutions ahead of challenges triggered by progress of the IoT society.
3．Activating organization and fostering human resources
In order to transform the Group into an organization that demonstrates creativity, it is necessary to secure various talents. In
addition to providing a stage where excellent talents from all over the world play an active role, the Group focuses on human
resource development including raising employees’ awareness.