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【全:英】ロゴ

【全:英】H1テキスト

Bonding Microscopic Worlds, Creating Innovative Futures

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H1

Medium-term Management Plan

Challenge Shinkawa 2020

Challenge Shinkawa 2020

Shinkawa aims to be the leading bonding technology company and always strives for innovation in bonding technology.

Net Sales

Operating income

The return on equity (ROE) of the final year is targeted at 10% level.

~Concept of returning profits to stakeholders~
The Group will actively make investments in its growth through capital investment, R&D and M&A such as developing new products that align with the IoT innovations adopted in customers’ production sites, and will achieve continual and stable profit return.

基本戦略

Basic strategy

1.Growth in existing business

With the arrival of the IoT age, there are various changes in demand for semiconductor packages. The Group promotes the functional enhancement of wire bonders and die bonders to handle the use of SSD data storages and high-speed memories. The Group also promotes the development and sales expansion of flip chip bonders to handle advanced bonding processes such as thermal compression bonding for 3 and 2.5-dimensional bonding applications that are used for memory cubes and the latest CPUs. Furthermore, along with higher functionality of communication devices such as smartphones, the Group enhances the function of flip chip bonders for high-performance packages such as PoP (Package-on-package) and FO-WLP (Fan-out Wafer Level Package).

2.Creating new business value

The Group, under the concept of “Shinkawa Smart Bonding Solution,” continues the development of solution technologies that incorporate the IoT function into the semiconductor assembly process. The Group will increase customer satisfaction and its associated value by promoting intelligent machines (with enhanced sensing function), intelligent networks (with enhanced data collection and analysis functions), and intelligent processes (with know-how embedded in software), as well as proposing solutions ahead of challenges triggered by progress of the IoT society.

3.Activating organization and fostering human resources

In order to transform the Group into an organization that demonstrates creativity, it is necessary to secure various talents. In addition to providing a stage where excellent talents from all over the world play an active role, the Group focuses on human resource development including raising employees’ awareness.

Approach to ESG

Approach to ESG

Environment

  • Creating a life cycle of products (Expansion of secondhand and refurbishment business)
  • Reduction of Co2 emissions from product use (Less power consumption)
  • Reduction of Co2 emissions from production
  • Environmentally conscious products and services

Society

  • Customer support
  • Occupational safety and health
  • Work–life balance
  • Improvement of working environment of overseas suppliers
  • Contribution to local societies
  • Promoting diversity

Governance

  • Corporate Governance and internal control
  • Global management system
  • Directors’ remuneration and incentive
  • Composition of board of directors
  • Thorough compliance
  • Risk management and visualization of potential risks
  • Business continuity planning (BCP)
  • Information security