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Bonding Microscopic Worlds, Creating Innovative Futures

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Summary

アンカー

Summary

Summary

Company Name SHINKAWA LTD.
Head Office 2-51-1 Inadaira, Musashimurayama-shi, Tokyo 208-8585, Japan
Telephone Number +81-42-560-1231
Established August 6, 1959
Paid-up Capital 8,360 million yen
Fiscal Year From April 1 to March 31
Stock Market Tokyo Stock Exchange, First Section
Number of Employees 712 (As of March 31, 2017)
Business Research, Development, Designing, Manufacturing, Sales and
After-Sales Service of Semiconductor Manufacturing Equipment.
Product Lineup Wire Bonders, Die Bonders and Flip Chip Bonders, etc.
Group Companies 11

History

History

Aug-59 Shinkawa Seisakusho Co., Ltd. was founded to engage in secondary processing of transistor parts (Paid-up capital ¥1 million, Head office located in Mitaka-shi, Tokyo)
Jun-63 Announced an automatic diode assembler
Jan-67 Moved head office to Musashimurayama-shi, Tokyo Introduced semi-automatic bonder for transistors
Aug-72 Introduced integrated type microcomputer for the first time in the industry
Jun-77 Introduced the world’s first, fully automatic wire bonder and tape bonder
Feb-80 Changed the company name to SHINKAWA LTD.
Apr-99 Acquired ISO9001 certification
Sep-00 Designated to the First Section of the Tokyo Stock Exchange
Mar-10 Introduced flip chip bonder for TCB process
Dec-12 Announced wire bonder 5000 series
Mar-13 Started production of the wire bonders in the assembly factory in Thailnd
May-16 Announced package bonder for multiple processes
Feb-17 Announced wide area handling high-speed wafer bump bonder