本文へスキップします。

在这里,可以找到新川的"连接"(English)

background
  • Flip Chip Bonder
  • Bump Bonder
  • Die Bonder
  • Wire bonding

I flip chips and connect them to substrates or wafers.
倒装贴片机(Flip Chip Bonder)
Flip Chip Bonder

I make solder bumps and place them on electronic devices.
植球机
(Bump Bonder)
Bump Bonder

I place chips on lead frames and connect them.
贴片机(Die Bonder)
Die Bonder

I connect chips and leads with wires.
焊线机(Wire Bonder)
Wire bonding