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DIE BONDER
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WIRE BONDER
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8-inch Application

Mold CSP, Wafer Level CSP

 8-inch
Features
● Package sorter for diced solid mold CSP, wafer level CSP Diced packages attached on tape are sorted very quickly in a tray
●

Available with a flip mechanism that attaches the ball upside down for live-bug style very quickly - The world highest speed level (0.5s./package)
● In-line processing with dicer (option)
● DPS-260, unloader added version for additional sorting also available
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