Aiming at becoming the top bonder in the world SHINKAWA LTD.
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製品カタログ
Outline of the business and products
DIE BONDER
ー
WIRE BONDER
COF BONDER
FLIP CHIP BONDER
BUMP BONDER
DISCRETE ASSEMBLERS
PACKAGE SORTER
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Application

Discrete Devices, Small ICs

 8-inch
Features
● Preformless eutectic die bonder that attains 20000 UPH
●

Employing a low-vibration, one-piece casting construction frame achieves high speed bonding
● User friendly operation through a GUI
● Epoxy dispenser can be incorporated（option）
Application

Discrete Devices, LED, Small ICs
Features
● Capable of high spees bonding of 50ms/0.7mm wire.(Conventional type speed 65ms/0.7mm)
●

Productivity of discrete devices improved by employing Shinkawa NRS tecnology for a high speed XY drive with ultra low vibration.
● Simultaneous detection in X direction and Y direction available.
●

Variety of indexing systems available

(open flexble indexer / fixed tunnel indexe r/ hoop feeder)
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