Aiming at becoming the top bonder in the world SHINKAWA LTD.
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製品カタログ
Outline of the business and products
DIE BONDER
ー
WIRE BONDER
COF BONDER
FLIP CHIP BONDER
BUMP BONDER
DISCRETE ASSEMBLERS
PACKAGE SORTER
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Application

Discrete Devices, Small ICs

 8-inch
Features
● Preformless eutectic die bonder that attains 20000 UPH
●

Employing a low-vibration, one-piece casting construction frame achieves high speed bonding
● User friendly operation through a GUI
● Epoxy dispenser can be incorporated（option）
Application

Discrete Devices, Small ICs
Features
● Productivity of discrete devices improved by employing Shinkawa NRS technology for a high speed XY drive with ultra low vibration
●

Simultaneous detection in Y direction added to conventional simultaneous detection in X direction. Best choice for production of matrix frames such as QFNs
● Looping technique cultivated through experience with CSP(Chip Size Package) offers ideal loop shape for small packages
● Tunnel type, open type and universal indexers are available
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