Bumps are formed on pads of dies fed from waffle pack trays using the gold wire ball bonding method
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Shinkawa RPS technology provides a solution to positional deviations at fine pitch bonding with closed loop control of capillary tip position, enabling 40 μm pitch bonding
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Shinkawa NRS technology delivers stable bondability by minimizing the vibrations that hampers fine pitch bonding
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Higher UPH achieved by
high speed die transport and dual leveling stage
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GUI enables intuitive
operation
Application
Wafer Bump
8-inch
Features
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Bumps are formed directly on pre-diced wafer pads using the gold wire ball bonding method.
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Compact machine body handles eight-inch wafers.
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High accuracy bonding
achieved by ultra-low- vibration XY linear drive of bonding
head with implementation of Shinkawa NRS technology.
