Aiming at becoming the top bonder in the world SHINKAWA LTD.
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製品カタログ
Outline of the business and products
DIE BONDER
ー
WIRE BONDER
COF BONDER
FLIP CHIP BONDER
BUMP BONDER
DISCRETE ASSEMBLERS
PACKAGE SORTER
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Application

Discrete Devices, LED,
SAW Filter, Quartz Oscillator

 8-inch
Features
● High speed bonding of small chips
●

Stable thermosonic bonding through newly developed transducer and very precise force control
●

Applicable for several types of substrates by replacing conversion parts
● Compact body handles eight-inch wafers. Wafer auto loader can be installed
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