Aiming at becoming the top bonder in the world SHINKAWA LTD.
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製品カタログ
Outline of the business and products
DIE BONDER
ー
WIRE BONDER
COF BONDER
FLIP CHIP BONDER
BUMP BONDER
DISCRETE ASSEMBLERS
PACKAGE SORTER
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Application

COF(Chip On Film)

8-inch
Features
Super high-precision bonding achieved by adopting high magnification optical probe and linear motor that enabled higher XY table resolution
Super high-speed vision system and Shinkawa NRS technology allow higher throughput
Employs thermo-eutectic, thermocompression bonding system
Particle control improved by incorporating HEPA filter as the standard feature and adopting flat cables on moving sections
Operability improved with touch-screen monitor
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