Capable of performing high speed bonding at

60ms/2mm wire

Shinkawa NRS technology provides high speed drive

with minimum vibration, which realizes stable

35μm pad pitch bonding

Shinkawa RPS technology allows automatic alignment

of capillary tip position, securing fine pitch bonding

free from positional deviation

Variety of loop modes are available to run

multi-stacked dies

Wire bonder designed for bonding different kinds of substrates, such as COBs and HICs.

Superior bondability achieved from the advanced

capabilities of the model UTC-1000.

High precision bonding with implementation of

Shinkawa RPS technology.

Capable of running ceramic substrates with a

maximum four-zone independent temperature control

system.