|
|
 |
 |
Application
CSP, BGA, Small Substrate,
Leadframe Type ICs |
|
|
 |
| Features |
| ● |
Capable of high speed bonding of 50ms/2mm wire. |
| ● |
Low inertia realized by the combination of short transducer and bond holder using CRFP(10% lower than conventional type). |
| ● |
Succeeded in weightsaving of Y motor (50% lighter than conventional type) by using CRFP and in developing high rigidity XY table at the same time. |
| ● |
Landing detection method at bonding is selectable between conventional position detection mode and newly added force detection mode that allows detdction of force change in real time.Force detection mode enables high speed bonding operation. |
| ● |
High perfprmance DSP and CPU adopted for control computer in order to achieve high speed and yet stable operation.(Processing speed 6 times faster than conventional system). |
| ● |
Bond Inspection Measurement(B.I.M.)System measures the ball diameter and position,and feed back the amount of deviation to the machine. |
| ● |
Automatic Free Air Ball Measurement System(F.A.M.) is capable of measuring free air ball diameter. |
| ● |
The Shinkawa NRS technology and the Shinkawa RPS technology are incorporated as
well as the conventional model. |
|
|
|
 |
 |
|
Application
QFN,lower pin count ICs,LED
|
|
|
|
| Features |
| ● |
Best choice for production of low-pin devices such as QFNs. |
| ● |
Capable of high speed bonding of 50ms/2mm wire. |
| ● |
Bond inspection Measurement (BIM) System measures the ball diameter and position, and feed back the amount of deviation to the machine. (BIM :Bond Inspection Measurement) |
| ● |
Shinkawa NRS technology provides high speed drive with minimum vibration. |
| ● |
Maximum Y bonding area of 80mm realized. |
|
|
 |
 |
|
Application
Ceramic Substrate, Glass Epoxy
Substrate,
COB, HIC |
|
|
|
| Features |
| ● |
Wire bonder designed for bonding different kinds of substrates, such as COBs and HICs.
Superior bondability achieved from the advanced
capabilities of the model UTC-1000. |
| ● |
High precision bonding with implementation of
Shinkawa RPS technology. |
| ● |
Capable of running ceramic substrates with a
maximum four-zone independent temperature control
system. |
| ● |
Maximum bonding area of 90 × 66 mm. |
|
