SEMICON Singapore 2008 was held at Singapore International Convention & Exhibition Centre(Suntec) from May 5 to 7.

Shinkawa exhibited and introduced our latest products as below.

【Die Bonder SPA-400】

【Wire Bonder UTC-2000 Super】

【Wire Bonder ACB-1000 Super】

<To visitors>

We would like to thank you for visiting our booths in this show.

Please feel free to contact us if you have any questions regarding our products.

We will strive to further improve our products and look forward to supporting you.