SEMICON China 2008 was held at Shanghai New Iternational Expo Centre(SNIEC) from March 18 to 20.

Shinkawa exhibited and introduced our latest products as below.

【Wire Bonder　UTC-2000 Super】

【Discrete Assembler　SDW-1000】

<To visitors>

We would like to thank you for visiting our booths in this show.

Please feel free to contact us if you have any questions regarding our products.

We will strive to further improve our products and look forward to supporting you.