Aiming at becoming the top bonder in the world SHINKAWA LTD.
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Summary

【Name of the company】 SHINKAWA LTD.
【Head Office】 2-51-1, Inadaira Musashimurayama-shi Tokyo, 208-8585, Japan
【Telephone number】 +81-42-560-1231
【Established】 August 6, 1959
【Capital】 ¥8,360,000,000
【Fiscal Year End】 March 31
【Stock Market】 Tokyo Stock Exchange, First Section
【Number of employees】 604 (As of Mar. 31, 2008)
【Business】

Research, development, designing, manufacturing, sales and

after-sales service of semiconductor manufacturing equipment.

   
【Product Lineup】 Wire Bonders, Die Bonders, Tape Bonders, Bump Bonders and Flip Chip Bonders, etc.
スペーサー スペーサー
【Group Companies】 Shinkawa Technologies Ltd. (Tokyo, Japan)
Shinkawa Korea Co., Ltd. (Sungnam-shi, Korea)
Shinkawa Taiwan Co., Ltd. (Taipei, Taiwan)
スペーサー Shinkawa (Shanghai) Co., Ltd. (Shanghai, China)
Shinkawa Philippines, Inc. (Manila, Philippines)
Shinkawa Singapore Pte. Ltd. (Singapore)
Shinkawa (Malaysia) Sdn. Bhd. (Subang Jaya, Malaysia)
Shinkawa (Thailand) Co., Ltd. (Bangkok, Thailand)
Shinkawa U.S.A., Inc. (Mesa Arizona, U.S.A.)
スペーサー
【Offices and Service Stations】 Kyushu Service Center (Fukuoka,Japan)
Philippines (Baguio)
Taiwan (Taichung, Kaohsiung)
China (Shanghai, Leshan, Suzhou)
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