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Summary
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| 【Name
of the company】 |
SHINKAWA LTD. |
|
【Head Office】 |
2-51-1,
Inadaira Musashimurayama-shi Tokyo, 208-8585, Japan |
| 【Telephone
number】 |
+81-42-560-1231 |
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【Established】 |
August
6, 1959 |
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【Capital】 |
￥8,360,000,000 |
| 【Fiscal
Year End】 |
March
31 |
| 【Stock
Market】 |
Tokyo
Stock Exchange, First Section |
|
【Number of employees】 |
604
(As of Mar. 31, 2008) |
| 【Business】 |
Research, development, designing, manufacturing, sales and
after-sales service of semiconductor manufacturing equipment. |
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【Product Lineup】 |
Wire Bonders, Die Bonders, Tape Bonders, Bump Bonders and Flip Chip Bonders, etc. |
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【Group Companies】 |
Shinkawa
Technologies Ltd. (Tokyo, Japan) |
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Shinkawa
Korea Co., Ltd. (Sungnam-shi, Korea) |
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Shinkawa Taiwan Co.,
Ltd. (Taipei, Taiwan) |
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Shinkawa
(Shanghai) Co., Ltd. (Shanghai, China) |
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Shinkawa
Philippines, Inc. (Manila, Philippines) |
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Shinkawa
Singapore Pte. Ltd. (Singapore) |
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Shinkawa
(Malaysia) Sdn. Bhd. (Subang Jaya, Malaysia) |
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Shinkawa
(Thailand) Co., Ltd. (Bangkok, Thailand) |
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Shinkawa
U.S.A., Inc. (Mesa Arizona, U.S.A.) |
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【Offices and Service Stations】 |
Kyushu
Service Center （Fukuoka,Japan） |
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Philippines
（Baguio） |
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Taiwan
（Taichung, Kaohsiung） |
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China
（Shanghai, Leshan, Suzhou） |
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| (C) Copyright SHINKAWA LTD. |
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