 |
|
|
| 【Campany Name】 |
SHINKAWA LTD. |
|
【Head Office】 |
2-51-1
Inadaira, Musashimurayama-shi, Tokyo 208-8585, Japan |
| 【Telephone
number】 |
+81-42-560-1231 |
|
【Established】 |
August
6, 1959 |
|
【Paid-up Capital】 |
￥8,360million(As of March.31, 2009) |
| 【Fiscal
Year】 |
From April 1 to March
31 |
| 【Stock
Market】 |
Tokyo
Stock Exchange, First Section |
|
【Number of employees】 |
647 (As of March. 31, 2009) |
| 【Business】 |
Research, development, designing, manufacturing, sales and
after-sales service of semiconductor manufacturing equipment. |
| |
|
|
【Product Lineup】 |
Wire Bonders, Die Bonders, Tape Bonders, Bump Bonders and Flip Chip Bonders, etc. |
|
|
|
【Group Companies】 |
Shinkawa
Technologies Ltd. (Tokyo, Japan) |
|
Shinkawa
Korea Co., Ltd. (Sungnam, Korea) |
|
Shinkawa Taiwan Co.,
Ltd. (Taipei, Taiwan) |
|
Shinkawa
(Shanghai) Co., Ltd. (Shanghai, China) |
|
Shinkawa
Philippines, Inc. (Manila, Philippines) |
|
Shinkawa
Singapore Pte. Ltd. (Singapore) |
|
Shinkawa
(Malaysia) Sdn. Bhd. (Subang Jaya, Malaysia) |
|
Shinkawa
(Thailand) Co., Ltd. (Bangkok, Thailand) |
|
Shinkawa Vietnam Co., Ltd. ( Ho Chi Minh, Vietnam) |
|
Shinkawa
U.S.A., Inc. (Mesa Arizona, U.S.A.) |
|
|
|
【Offices and Service Stations】 |
Kyushu
Service Center （Fukuoka, Japan） |
|
Taiwan
（Taichung ・ Kaohsiung） |
|
China
（Leshan ･ Suzhou） |
|
Philippines
（Baguio）Taiwan |
