【Supporting the assembly process of semiconductor production】

The semiconductor production process consists of the wafer process to form a circuit on a silicon wafer and the assembly process to split the wafer into IC chips for assembly into a semiconductor product. The Shinkawa precision robot assembles the IC chips into semiconductor products, bonds the chips onto lead frames (die-bonding process), and then uses gold wire to connect the electrodes of the bonded chip and the lead frame (wire-bonding process).

In the past, electrodes were manually connected. By the end of the 1960s, Shinkawa succeeded in commercializing the first fully automatic wire bonder in the world, which earned the trust of the world's semiconductor manufacturers. Now, the company is one of the world’s leading players in the wire bonder market.

【An all-round player in the bonding equipment sector】

There are two bonding methods: wire bonding and wireless bonding. Shinkawa produces the tape bonders and the flip chip bonders used in the wireless bonding process, as well as the die bonders and the wire bonders required in the wire bonding process. Shinkawa is second-to-none in the industry as the only manufacturer handling all types of equipment for the bonding processes. Our products and services create higher customer satisfaction as an all-round player with comprehensive solutions to the needs of technological development and support for bonding.