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We, the Shinkawa group have been expanding our business as "an all-round player in the bonding equipment sector" since we succeeded in automation of the wire bonding process for the first time in the world in 1977. We commemorated the company’s 50th anniversary in August 2009. On behalf of the Shinkawa group, let me express our sincere appreciation for your patronage and continued support, which has enabled us to continue in business for such a long time.
To make Shinkawa’s 50th anniversary year memorable for yet another reason, we have strived to enhance our core competence.However, we have been facing a challenging business environment since last year along with a sharp decline in capital investment by semiconductor manufacturers due to the most severe global recession to hit the world in 100 years.
Now, we are dealing with the challenge by reforming our cost structure to promote further efficiency and rationalization. In the past, the Shinkawa group has tackled and overcome many difficult circumstances by cultivating new markets as an innovator with a persevering entrepreneurial spirit, turning crisis into great opportunities for a big step forward. So, we are taking this crisis as our biggest opportunity yet.
We installed a Communication & Technology center, a clean room and a laboratory room in our headquarters in fiscal 2005, which are utilized for improving the skills of application engineers as well as those of employees home and abroad. These investments have finally come to the stage of bearing fruit. Also, we have newly established the first overseas software development center for the Shinkawa group in Vietnam last August. By setting up the R&D center in Vietnam, where it is close to our Asian sales and after-sales service centers, we can establish a framework capable of promptly responding to the changes in the global market and further enhance our R&D power.
In addition, we are developing a new flip chip bonder for high pin-count devices which we did not undertake in the past, a wire bonder with wide bonding area, as well as an LED die bonder all in order to gain ground in a new field of customers this year. We are also feeling the need to transform ourselves from “an all-round player in the bonding equipment sector” by re-establishing our business portfolio and product portfolio in order to cope with the changes from the current business fluctuation along with the ongoing economic globalization. Therefore, we are now actively working not only on our in-house development of the new technology but also on the development of new businesses with possible alliance with companies of different industries.
We will strive for the creation of a new engine of growth for the Shinkawa group for the next 50 years by taking all these measures, and we hope for your continuous patronage and support.
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