Aiming at becoming the top bonder in the world SHINKAWA LTD.
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2010/2/8

Shinkawa Announces Results for The Nine Months of FYE March 31, 2010 (PDF52KB)

 
   

2009/12/16

SEMICON Japan 2009 Report

 
   

2009/11/9

Shinkawa Announces Results for The Six Months of FYE March 31, 2010 (PDF50KB)

 
   

2009/11/9

Update Message from the President and COO

 

 
   

2009/10/7

SEMICON Taiwan 2009 Report

 
   

2009/8/11

Update IR page

 
   

2009/8/6

Annual Report 2009 is now available (PDF 5,673KB)

 
   

2009/8/3

 

SHINKAWA VIETNAM CO., LTD. which became the first software development foothold in our company started a business

 
   

2009/5/27

 

Presentation Material for analyst meeting: FY2008 Consolidated Results (1092KB)

 
   

2009/5/15

Shinkawa Announces Results for the Fiscal Year Ended March 31, 2009

 
   

2009/4/6

SEMICON China 2009 Report

 
       
 
 
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Shinkawa commands the top global share as a manufacturer of bonders for
the assembly process of semiconductor manufacturing (packaging). In a
dramatically changing semiconductor industry, the company has met the

expectations of the world's semiconductor manufacturers for more than

forty years as a reliable brand.

A global leader in the manufacture of semiconductor production equipment SHINKAWA LTD.
(C) Copyright SHINKAWA LTD.