Aiming at becoming the top bonder in the world SHINKAWA LTD.
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2009/5/27

 

Presentation Material for analyst meeting: FY2008 Consolidated Results (1.06MB)

 
   

2009/5/15

Shinkawa Announces Results for the Fiscal Year Ended March 31, 2009

 
   

2009/4/6

SEMICON China 2009 Report

 
   

2009/4/2

Update Message from the President and COO

 
   

2009/3/3

Invitation to SEMICON China 2009

 
   

2009/2/9

Shinkawa Announces Results for the Third Quarter Ended December 31, 2008

 
   

2008/12/26

SEMICON Japan 2008 Report

 
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Shinkawa commands the top global share as a manufacturer of bonders for
the assembly process of semiconductor manufacturing (packaging). In a
dramatically changing semiconductor industry, the company has met the

expectations of the world's semiconductor manufacturers for more than

forty years as a reliable brand.

A global leader in the manufacture of semiconductor production equipment SHINKAWA LTD.
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